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| New radio frequency integrated circuits 5G chipset developed by Samsung Electronics / Courtesy of Samsung Electronics |
By Jun Ji-hye
Samsung Electronics has completed the development of next-generation radio frequency integrated circuits (RFICs) for fifth-generation (5G) base stations, spurring its efforts to enhance its presence in the global telecommunications equipment market, the tech giant said Friday.
The firm has developed the RFIC system, one of the core components in the 5G chipset, for 28GHz and 39GHz bands to target markets that use the bands such as the United States and Korea.
The Korean firm said it plans to commercialize additional RFICs for 24GHz and 47GHz this year, which will allow further expansion into markets that will utilize these higher frequency bands such as Europe.
Samsung's new RFICs enable about 25 percent reduction in size, weight and power consumption for 5G base stations, compared to the previous iterations.
The 5G base stations using the new chipsets will be more efficient in operation and roll-out, the firm said.
The coverage of the new RFIC has been extended 75 percent from 800MHz to a maximum of 1.4GHz to achieve ultra-fast data speeds.
The overall performance of the new product is enhanced by decreasing the noise level and improving the linearity characteristics of the RF power amplifier.
"Our breakthroughs in 5G R&D have been the key driving forces behind the successful 5G commercial services across the U.S. and Korea in 2018, with over 36,000 5G base station shipments," said Cheun Kyung-whoon, an executive vice president and head of Networks Business at Samsung Electronics.
"At the forefront of ushering in the wave of the Fourth Industrial Revolution, Samsung will continue to accelerate 5G commercialization ultimately impacting all industries and everyday lives by offering ultra-low latency, ultra-high speed and massive connectivity."
The firm has also developed Digital/Analog Front End (DAFE) ASICs, another core component of the 5G chipset.
The DAFE is essential for digital wireless telecommunications, providing analog-to-digital conversions and vice versa.
"Samsung is building on its 5G leadership with its innovative solutions including low-power RFICs and DAFE ASICs to pioneer a new era of digital transformation," said Jeon Jae-ho, an executive vice president and head of R&D, Networks Business at Samsung Electronics. "We're pleased to announce completion of the development of these new chipsets, which will play a vital role in pushing the advancement of technologies to the next level."
