Subscribe
E-Paper
 |
| Choi Si-young, president and head of Samsung Electronics' foundry business, delivers a keynote speech at Samsung Foundry Forum in Silicon Valley, Monday (local time). Courtesy of Samsung Electronics |
By Park Jae-hyuk
Samsung Electronics will mass-produce 1.4-nanometer chips by 2027, after introducing its 2nm process by 2025 with enhanced gate-all-around (GAA)-based technology, the conglomerate said Tuesday.
The Korean tech giant's announcement hinted at fiercer competition with its chief rival, Taiwan's TSMC, which also unveiled its own plan earlier this year to mass-produce 1.4-nm chips without specifying when it will actually achieve the goal.
"The technology development goal down to 1.4 nm and foundry platforms specialized for each application, together with stable supply through consistent investment, are all part of Samsung's strategy to secure customers' trust and support their success," Samsung Electronics President and Head of Foundry Business Choi Si-young said to around 500 participants in the company's annual Samsung Foundry Forum event in Silicon Valley, Monday (local time), which was held offline for the first time in three years.
"Realizing every customer's innovations with our partners has been at the core of our foundry service," he added.
During the event, Samsung detailed its "shell-first" strategy, which aims for the preemptive construction of clean rooms, so that fab equipment can be installed later and set up flexibly as needed in line with future demand. Through the strategy, the company expects itself to be able to respond better to customer demands.
Samsung also outlined the steps its foundry business will take: foundry process technology innovation, process technology optimization for each specific application, stable production capabilities and customized services for customers.
Following the foundry forum, Samsung said it will hold the Samsung Advanced Foundry Ecosystem (SAFE) Forum on Tuesday to introduce its technologies, strategies and partners in the fields of electronic design automation (EDA), intellectual property, outsourced semiconductor assembly and test (OSAT), design solution partner (DSP) and cloud computing.
Starting in the U.S. on Oct. 3, the Samsung Foundry Forum will be held sequentially in Munich on Oct. 7, Tokyo on Oct. 18 and Seoul on Oct. 20.
