Settings

ⓕ font-size

  • -2
  • -1
  • 0
  • +1
  • +2

LG Innotek CEO vows to become leader in FC-BGA substrates

  • Facebook share button
  • Twitter share button
  • Kakao share button
  • Mail share button
  • Link share button
LG Innotek CEO and President Jeong Cheol-dong, fourth from right, poses with company officials during an equipment bring-in ceremony at its factory in Gumi, North Gyeongsang Province, in this photo released by the company, Monday. Courtesy of LG Innotek
LG Innotek CEO and President Jeong Cheol-dong, fourth from right, poses with company officials during an equipment bring-in ceremony at its factory in Gumi, North Gyeongsang Province, in this photo released by the company, Monday. Courtesy of LG Innotek

By Baek Byung-yeul

Jeong Cheol-dong, CEO and president of LG Innotek, vowed that his company will become a global leader in a next-generation semiconductor packaging substrate known as flip chip ball grid array (FC-BGA), according to the IT parts arm of LG Group, Monday.

LG Innotek said it held a ceremony recently at its FC-BGA factory in Gumi, North Gyeongsang Province, to commemorate bringing in equipment. Last June, the company acquired the Gumi 4 factory and has been building a manufacturing line to produce FC-BGA substrates.

The new factory will be able to start mass-producing FC-BGA substrates in the second half of this year, the company added.

"The FC-BGA substrate is a business that LG Innotek can become a top supplier in as we have led the substrate materials market with the industry's top technology and productivity," Jeong said during the ceremony.

"We will make the FC-BGA business the global leading one by creating differentiated customer value."

LG Innotek's plant in Gumi, North Gyeongsang Province / Courtesy of LG Innotek
LG Innotek's plant in Gumi, North Gyeongsang Province / Courtesy of LG Innotek

Chip package substrates protect and ensure precise connection between integrated circuits and mainboards for reliable transmission of electrical signals.

The industry estimates more FC-BGAs will be used due to the increasing use of CPUs and GPUs in PCs, network servers and IT devices.

Last June, LG Innotek succeeded in mass-producing FC-BGA substrates for network, modem and digital TVs and has been supplying them to global customers since then.

LG Innotek said its new factory will be a smart factory that integrates the latest digital technologies such as artificial intelligence (AI) and robots. The new factory will help improve the company's market competitiveness as it plans to develop FC-BGA for PCs and servers, too.


Baek Byung-yeul baekby@koreatimes.co.kr


X
CLOSE

Top 10 Stories

go top LETTER