SK hynix headquarters in Icheon, Gyeonggi Province / Yonhap

SK hynix has joined forces with TSMC to develop its next-generation high-bandwidth memory (HBM) chips to meet the growing demand for artificial intelligence (AI) chips from global clients, the Korean chipmaker said Friday.

The SK affiliate aims to mass-produce the HBM4 sometime in 2026 under the technological tie with the Taiwanese foundry business leader. Both sides reached a consensus in jointly dealing with any request from customers regarding the sixth-generation HBM chips.

They also pledged to boost partnerships to integrate the AI memory chips with TSMC's CoWos, or chip-on-wafer-on-substrate, packaging technology.

SK hynix is the top global HBM provider. HBMs are crucial for AI services, and their adoption is widely expected to widen at a rapid pace in line with the growing popularity of AI applications here and abroad.

The chipmaker is going all-out to maintain the tech leadership in the industry. SK hynix is best known as an exclusive supplier of HBM chips to Nvidia, the world's dominant AI chipmaker.

SK hynix's latest AI memory chip, HBM3E / Courtesy of SK hynix

SK hynix and TSMC will initially place their focus on improving the performance of the base die placed at the bottom of HBM packages, according to the Korean chipmaker.

SK hynix also underscored the importance of tightening its three-way partnership among customers, foundry and memory solutions providers.

"We will achieve another HBM tech innovation by partnering with the world's top foundry firm, TSMC," the company said in a statement. "SK hynix will also break through memory tech limits under the three-way partnership."

SK hynix has teamed up with TSMC even in the initial phase of its HBM chip development. SK hynix aims to boost its robust presence in the AI memory chip market against its long-standing chip rivals, such as Samsung Electronics.

Top executives from SK hynix and TSMC spoke highly of the latest tech partnership and displayed confidence in leading the looming era for AI semiconductors.

"We will not just develop high-performance HBM4 chips under the collaboration with TSMC, but also speed up open partnerships with our global partnerships," Kim Joo-sun, president of SK hynix's AI infrastructure division, said. "SK hynix will solidify its footing as the total AI memory chip provider by enhancing our competitiveness in customer-oriented memory platforms."

Kevin Zhang, senior vice president of business development and deputy co-chief operating officer at TSMC, also promised to level up its tech ties with SK hynix for both sides to provide the world's top-level AI solutions.